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Title: Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film
Author: Qiu Lin(邱琳)1, 2; Wang, Xiaotian3; Su, Guoping1, 4; Tang, Dawei1; Zheng, Xinghua1, 5; Zhu, Jie1; Wang, Zhiguo6; Norris, Pamela M.2; Bradford, Philip D.7; Zhu, Yuntian7, 8
Source: SCIENTIFIC REPORTS
Issued Date: 2016-02-16
Volume: 6, Pages:21014
Keyword: 3-OMEGA METHOD ; CONDUCTIVITY ; GRAPHITE ; RESISTANCE ; DEFECTS ; CRYSTAL ; FIBERS ; FOAM
Subject: Carbon nanotubes and fullerenes,Phase transitions and critical phenomena
DOI: 10.1038/srep21014
Corresponding Author: Tang, DW ; Zheng, XH
DOC Type: Article
English Abstract: It has been more than a decade since the thermal conductivity of vertically aligned carbon nanotube (VACNT) arrays was reported possible to exceed that of the best thermal greases or phase change materials by an order of magnitude. Despite tremendous prospects as a thermal interface material (TIM), results were discouraging for practical applications. The primary reason is the large thermal contact resistance between the CNT tips and the heat sink. Here we report a simultaneous sevenfold increase in in-plane thermal conductivity and a fourfold reduction in the thermal contact resistance at the flexible CNT-SiO2 coated heat sink interface by coupling the CNTs with orderly physical overlapping along the horizontal direction through an engineering approach (shear pressing). The removal of empty space rapidly increases the density of transport channels, and the replacement of the fine CNT tips with their cylindrical surface insures intimate contact at CNT-SiO2 interface. Our results suggest horizontally aligned CNT arrays exhibit remarkably enhanced in-plane thermal conductivity and reduced out-of-plane thermal conductivity and thermal contact resistance. This novel structure makes CNT film promising for applications in chip-level heat dissipation. Besides TIM, it also provides for a solution to anisotropic heat spreader which is significant for eliminating hot spots.
WOS Headings: Science & Technology
WOS Subject: Multidisciplinary Sciences
WOS Subject Extended: Science & Technology - Other Topics
WOS Keyword Plus: 3-OMEGA METHOD ; CONDUCTIVITY ; GRAPHITE ; RESISTANCE ; DEFECTS ; CRYSTAL ; FIBERS ; FOAM
Indexed Type: SCI
Project Number: 51306183 ; 51336009 ; 2012CB933200 ; 201404910084 ; 201404910085 ; FA9550-12-1-0088
Funder: National Natural Science Foundation of China(51306183 ; National Basic Research Program of China(2012CB933200) ; China Scholarship Council(201404910084 ; US Air Force Office of Scientific Research(FA9550-12-1-0088) ; Nanjing University of Science and Technology ; 51336009) ; 201404910085)
Language: 英语
WOS ID: WOS:000370296400001
Citation statistics:
Content Type: 期刊论文
URI: http://ir.etp.ac.cn/handle/311046/112346
Appears in Collections:中国科学院工程热物理所(论文库)_期刊论文(SCI)

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description.institution: 1.Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China
2.Univ Virginia, Dept Mech & Aerosp Engn, Charlottesville, VA 22904 USA
3.Nanyang Technol Univ, Sch Mat Sci & Engn, 50 Nanyang Ave, Singapore 639798, Singapore
4.Shenhua Guohua Beijing Elect Power Res Inst Co Lt, Beijing 100025, Peoples R China
5.Univ Calif Riverside, Dept Mech Engn, Riverside, CA 92521 USA
6.China Natl Elect Engn Co Ltd, Beijing 100048, Peoples R China
7.N Carolina State Univ, Dept Mat Sci & Engn, Box 7907, Raleigh, NC 27695 USA
8.Nanjing Univ Sci & Technol, Sch Mat Sci & Engn, Nanjing 210094, Jiangsu, Peoples R China

Recommended Citation:
Qiu, Lin,Wang, Xiaotian,Su, Guoping,et al. Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film[J]. Scientific Reports,2016,6:21014.
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